ISP Information:
A paste that is applied between a microprocessor and heatsink. This paste fills in any tiny gaps that may be present on the visibly flat surfaces of the microprocessor package and heatsink. Without thermal compound cooling may be less efficient, as the heatsink and microprocessor package may have air gaps between them. Thermal compound has much more efficient heat exchange properties than air.
ISP Glossary:
Thermal Compound - Hi,Thanks to an overzealous phone contractor, I am stuck with a 1000'foot spool of 50-pair, outdoor rated, non-gel filled telephone cable.It was ordered, vut, delivered and never used.I would like to recoup some of my losses and sell this cable. Cananyone give me an idea of a fair price, and how I would go aboutselling it? Already tried Ebay, and had no luck.Thanks,Rick BestanyBaltimore MD
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